半自动数控内圆切片机J5060B

半自动数控内圆切片机J5060B

主要用途和适用范围:

J5060B型半自动数控内圆切片机主要适用于磁性材料、半导体材料、宝石、陶瓷、各种玻璃等硬脆材料的精密切割。

Main Features:

J5060B Inside diameter slicer of fully automatic digital control is mainly used of for precision cutting of hard and brittle materials such as magnetic material,semiconducting material,jewel,ceramics,various glasses etc.

技术参数:

名称 NAME J5060B
最大加工尺寸 Max process dimension ¢60*80mm
切割速度 Cutting speed 5-50mm/min
切割片厚 Thickness of sliced pars ≥0.30mm
横向行程 Cross worktable length(X) 100mm
纵向行程 Longitudinal worktable length(Y) 100mm
主轴电机 Axial motor data 750W.2800r/min
主轴转速 Range of spindle speed 3000r/min
冷却箱容积(L) Volume with cooling box 50
设备外形尺寸 Overall dimension(L*W*H) 750*860*1620mm
设备重量 Net weight of the machine 1000kg
电源 Power supply AC380V.50HZ
注:技术不断进步,参数诺若变动,恕不另行通知。
The specification are subject to change without notice

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