半自动数控内圆切片机J50100B

半自动数控内圆切片机J50100B

主要用途和适用范围:

J50100B型半自动数控内圆切片机主要适用于磁性材料、半导体材料、宝石、陶瓷、各种玻璃等硬脆材料的精密切割。

Main Features:

J50100B Inside diameter slicer of fully automatic digital control is mainly used of for precision cutting of hard and brittle materials such as magnetic material,semiconducting material,jewel,ceramics,various glasses etc.

技术参数:

名称 NAME J50100B
最大加工尺寸 Max process dimension ¢100*80mm
切割速度 Cutting speed 5-50mm/min
进给量 Slice parallel 0.01mm
横向行程 Cross worktable length(X) 120mm
纵向行程 Longitudinal worktable length(Y) 100mm
主轴电动机 Axial motor data 1100W.2800r/min
主轴转速 Range of spindle speed 1500.2000r/min
工作夹具调节量 Measurement with workpiece
水平角度 Angle with level ±45°
俯仰角度 Survey angle ±10°
垂直升降 Up and down with upright 24mm
冷却箱容积(L) Volume with cooling box 50
设备外形尺寸 Overall dimension(L*W*H) 860*900*1600mm
设备重量 Net weight of the machine 1200kg
电源 Power supply AC380V.50HZ
工作环境 Working environment 温度5~35°,相对湿度40~80%
气压86~106kpa
注:技术不断进步,参数诺若变动,恕不另行通知。
The specification are subject to change without notice

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